Front access DSX assembly

ABSTRACT

A DSX jack module having removable jacks is disclosed. The jack module includes a jack mount for holding the jacks. The jack module also includes a front facing cross-connect array and a front facing IN/OUT array. A circuit board is electrically connected to the arrays. The circuit board includes portions positioned directly behind the cross-connect array and the IN/OUT array. A chassis for holding jack modules is also disclosed. The chassis includes a front door having a double hinge configuration.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.09/967,316 filed on Sep. 28, 2001, now U.S. Pat. No. 6,840,815 whichapplication is incorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates generally to telecommunications equipment.More particularly, the present invention relates to digitalcross-connect equipment.

BACKGROUND OF THE INVENTION

A digital cross-connect system (DSX) provides a location forinterconnecting two digital transmission paths. The apparatus for a DSXis located in one or more frames, or bays, usually in a telephoneservice provider's central office. The DSX apparatus also provides jackaccess to the transmission paths.

DSX jacks are well known and typically include a plurality of boressized for receiving plugs. A plurality of switches are provided withinthe bores for contacting the plugs. The jacks are electrically connectedto digital transmission lines, and are also electrically connected to aplurality of termination members used to cross-connect the jacks. Byinserting plugs within the bores of the jacks, signals transmittedthrough the jacks can be interrupted or monitored.

FIG. 1 schematically illustrates a DSX system that is an example of thetype found at a telephone service provider's central office. The DSXsystem is shown including three DSX jacks 10 a, 10 b and 10 c. Each DSXjack 10 a, 10 b and 10 c is connected to a specific piece of digitalequipment. For example, jack 10 a is shown connected to digital switch12, jack 10 b is shown connected to office repeater 14 a, and jack 10 cis shown connected to office repeater 14 b. Each piece of digitalequipment has a point at which a digital signal can enter, as well as apoint at which the digital signal can exit. The jacks 10 a, 10 b and 10c each include OUT termination pins 16 and IN termination pins 18. TheDSX jacks 10 a, 10 b and 10 c are connected to their correspondingpieces of digital equipment by connecting the OUT termination pins 16 tothe signals exiting the equipment (i.e., going toward the DSX system)and the IN termination pins 18 to the signals entering the equipment(i.e., going away from the DSX system).

Referring still to FIG. 1, jacks 10 a and 10 b are “cross-connected” toone another by semi-permanent connections. The semi-permanentconnections extend between cross-connect fields 19 of the jacks 10 a and10 b. For example, patch cords 20 connect OUT cross-connect pins of jack10 a to IN cross-connect pins of jack 10 b. Similarly, patch cords 21connect IN cross-connect pins of jack 10 a to OUT cross-connect pins ofjack 10 b. The jacks 10 a and 10 b are preferably normally closed. Thus,in the absence of a plug inserted within either of the jacks 10 a and 10b, an interconnection is provided between the jacks 10 a and 10 b andtherefore between digital switch 12 and office repeater 14 a.

The semi-permanent connection between the digital switch 12 and theoffice repeater 14 a can be interrupted for diagnostic purposes byinserting plugs within the IN or OUT ports of the jacks 10 a and 10 b.Likewise, patch cords can be used to interrupt the semi-permanentconnection between the jacks 10 a and 10 b to provide connections withother pieces of digital equipment. For example, the digital switch 12can be disconnected from the office repeater 14 a and connected to theoffice repeater 14 b through the use of patch cords 23. The patch cords23 include plugs that are inserted within the IN and OUT ports of thejack 10 a and the IN and OUT ports of the jack 10 c. By inserting theplugs within the IN and OUT ports of the jack 10 a, the normally closedcontacts are opened, thereby breaking the electrical connection with theoffice repeater 14 a and initiating an electrical connection with officerepeater 14 b.

SUMMARY OF THE INVENTION

One embodiment of the present invention relates to a DSX system having across-connect field and an IN/OUT field that are accessible from thefront of the system.

Another embodiment of the present invention relates to a DSX systemhaving a cross-connect field, an IN/OUT field and a monitor field thatare accessible from the front of the system.

Another embodiment of the present invention includes atelecommunications chassis having a double-hinged door for coveringselected portions of the chassis.

A variety of aspects of the invention are set forth in part in thedescription that follows, and in part will be apparent from thedescription, or may be learned by practicing the invention. The aspectsof the invention relate to individual features as well as combinationsof features. It is to be understood that both the foregoing generaldescription and the following detailed description are exemplary andexplanatory only, and are not restrictive of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a prior art DSX system;

FIG. 2A is a front perspective view of a DSX system that is anembodiment of the present invention, the system includes a chassishaving a bi-fold front door that is shown in an open position;

FIG. 2B shows the DSX system of FIG. 2A with one panel of the front doorin a closed position;

FIG. 2C shows the DSX system of FIG. 2A with both panels of the frontdoor in closed positions;

FIG. 3 is a front exploded view of the chassis of the DSX system of FIG.2A;

FIG. 4 shows two of the DSX systems of FIG. 2A mounted on a conventionaltelecommunications rack;

FIG. 5A is a front perspective view of one of the DSX jack modules ofthe DSX system of FIG. 2A;

FIG. 5B is an exploded view of the DSX jack module of FIG. 5A;

FIG. 5C illustrates the DSX jack module of FIG. 5A with the DSX jacksremoved;

FIG. 5D is a rear view of the DSX jack module of FIG. 5C;

FIGS. 6A and 6B are circuit schematics of odd and even DSX jacks of theDSX jack module of FIG. 5A;

FIG. 7A is front perspective view of a DSX system that is anotherembodiment of the present invention, a bi-fold front door of the systemis shown in an open position;

FIG. 7B shows the DSX system of FIG. 7A with one panel of the bi-folddoor in a closed position;

FIG. 7C shows the DSX system of FIG. 7A with both panels of the bi-foldpanel in closed positions;

FIG. 8 is an exploded view of the chassis of the DSX system of FIG. 7A;

FIG. 9A is a front perspective view of one of the DSX jack modules ofthe DSX system of FIG. 7A;

FIG. 9B is an exploded view of the DSX jack module of FIG. 9A;

FIG. 9C shows the DSX jack module of FIG. 9A with the DSX jacks removed;

FIG. 9D is a rear perspective view of the DSX jack module of FIG. 9C;and

FIGS. 10A and 10B are circuit schematics of odd and even DSX jacks ofthe DSX jack module of FIG. 9A.

DETAILED DESCRIPTION

Reference will now be made in detail to exemplary aspects of the presentinvention that are illustrated in the accompanying drawings. Whereverpossible, the same reference numbers will be used throughout thedrawings to refer to the same or like parts.

FIGS. 2A–2C illustrate a DSX system 30 that is an embodiment of thepresent invention. The DSX system 30 includes a chassis 32 for holding aplurality (e.g., 16) of removable jack modules 34. Each of the jackmodules 34 includes a jack mount 35 configured to hold a plurality ofjacks (e.g., two odd jacks 36 and two even jacks 38). The jack modules34 also each include a forwardly facing cross-connect block 40 and aforwardly facing IN/OUT block 42. The blocks 40, 42 can also be referredto as panels, arrays or fields. The blocks 40, 42 include a plurality oftermination structures such as wire wrap pins 44 or other types ofconnectors/contacts for terminating a wire (e.g., insulationdisplacement connectors; co-axial connectors such as BNC connectors,1.6/5.6 connectors or SMB connectors; or RJ series connectors such asRJ45 connectors, RJ48 connectors or RJ21 connectors). The chassis 32 ofthe DSX system 30 includes a front door 46 for covering thecross-connect blocks 40 and the IN/OUT blocks 42.

I. Chassis of First Embodiment

FIG. 3 is an exploded view of the chassis 32 of the DSX system 30. Thechassis 32 includes top and bottom walls 70, 72 interconnected by leftand right sidewalls 73L, 73R. Top and bottom walls 70, 72 and side walls73L, 73R cooperate to define a chamber or housing for receiving the jackmodules 34. The top wall 70 includes a top panel 70′ that can be removedto facilitate access to the interior of the housing during insertion orremoval of the jack modules 34. Mounting flanges 74 are mounted on theleft and right side walls 73L, 73R. The mounting flanges 74 are used toconnect the chassis 32 to a conventional telecommunications rack 76 asshown in FIG. 4.

It will be appreciated that the chassis 32 is preferably adapted forhousing a plurality of jack modules. To conform with conventionalinternational standards, the chassis 32 can have a length of about 19inches. This embodiment can house, for example, 16 jack modules.Alternatively, in accordance with standard United States specifications,the chassis could be configured to have a length of about 23 inches.This embodiment can house, for example, 21 jack modules. Of course,other sizes of chassis and other numbers of jack modules could also beused.

As indicated previously, the chassis 32 includes front door 46 forcovering the cross-connect blocks 40 and the IN/OUT blocks 42 of thejack modules 34. The front door 46 includes a lower panel 48 pivotallyconnected to the front edge of the bottom wall 72 of the chassis 32 by alower hinge 50. The front door 46 also includes an upper panel 52pivotally connected to an upper edge of the lower panel 48 by an upperhinge 54. The hinges 50 and 54 are shown in a horizontal orientation andare oriented parallel to one another. The lower panel 48 is preferablysized to cover the IN/OUT blocks 42 of the DSX system 30, and the upperpanel 52 is preferably sized to cover the cross-connect blocks 40 of theDSX system 30. FIG. 2A shows the front cover panel 46 completely opensuch that both the cross-connect blocks 40 and the IN/OUT blocks 42 areaccessible. FIG. 2B shows the front door 46 with only the lower panel 48closed. The lower panel 48 is held in the closed position by thumbscrews56 (shown in FIG. 2B) threaded within internally threaded openings 58defined by front tabs 60 (shown in FIG. 2A) of the chassis 32. In theposition of FIG. 2B, the cross-connect blocks 40 can be accessed whilethe IN/OUT blocks 42 remain protected by the lower panel 48. FIG. 2Cshows the front door 46 with both the lower panel 48 and the upper panel52 in closed positions. The upper panel 52 is held in the closedposition by retractable latches 62 (shown in FIGS. 2A and 2B) that slidebehind front retaining members 64 (shown in FIG. 2A) of the chassis 32when the upper panel 52 is closed. A circuit designation label can beprovided on the door 46 (e.g., on the front face of the tipper panel 52as shown in FIG. 2C).

The chassis 32 also includes cable management structure corresponding tothe cross-connect blocks 40 and the IN/OUT blocks 42. For example, thebottom wall 72 of the chassis 32 includes cable tie down loops 75 (shownin FIG. 3) for tying down cables routed to and from the IN/OUT blocks42. Also, the chassis includes a drop-in, removable divider 77 (shown inFIG. 3) for supporting cables routed to and from the cross-connectpanels 40, and for keeping the cross-connect cables separate from theIN/OUT cables. When mounted in the chassis 32, the divider 77 projectsforwardly from the blocks 40, 42 and is positioned between the blocks40, 42. To hold the divider 77 in place, tabs 79 a of the divider 77 fitwithin notches 79 b of the chassis 32. The divider 77 functions as acable support tray for holding cables laterally routed to and from thecross-connect blocks 40.

Referring again to FIG. 3, the chassis 32 includes a power strip coverplate 78 and power strip 80 that are mounted adjacent the top of thechassis 32. The power strip 80 includes a plurality of electricalreceptacles 82 a electrically connected to a main power connector 84.The electrical receptacles 82 a align with and are set behind openings86 defined by the power strip cover plate 78. Each of the electricalreceptacles 82 a preferably defines a sleeve ground socket 88 a, a powersocket 90 a, and a power return socket 92 a. The main power connector 84includes conductive pins 94–96. Pin 94 is electrically connected inseries with the sleeve ground sockets 88 a, pin 95 is electricallyconnected in series with the power sockets 90 a, and pin 96 iselectrically connected in series with the power return sockets 92 a.Pins 95 and 96 are electrically connected to a front power panel 100mounted on the flange 74 located at right side wall 73R. The front powerpanel 100 includes a power (i.e., battery or voltage) contact 102 wiredto pin 95 and a battery/power return contact 104 wired to pin 96. Thechassis 32 also includes a sleeve ground panel 106 mounted on the flange74 located at the left side wall 73L. The sleeve ground panel 106includes a sleeve ground contact 108 (i.e., a shield ground) that ispreferably wired to pin 94 of the main power connector 84. The sleeveground panel 106 also can include a chassis ground contact 110. In someembodiments, a jumper strap (not shown) can electrically connect thesleeve ground contact 108 to the chassis ground contact 110.

The front power panel 100 and the front sleeve ground panel 106 allowall grounding and power source wiring of the DSX system 30 to beaccomplished from the front of the chassis 32. Further, because all ofthe components of the chassis 32 (e.g., the jacks 36, 38; thecross-connect blocks 40; the IN/OUT blocks 42; the power panel 100; andthe sleeve ground panel 106) are accessible from the front of thechassis 32, two of the chassis 32 can be mounted back-to-back in a rackto increase the capacity of the rack.

To mount jack modules 34 within the chassis 32, the front door 46 isopened as shown in FIG. 2A and the jack modules 34 are inserted throughthe open front end of the chassis 32. The jack modules 34 are insertedrearwardly into the chassis 32 until the jack modules engage a mountingflange 69 (shown in FIG. 3) that projects upwardly from the bottom wall72 of the chassis 32. Fasteners 127 (shown in FIG. 5B) are then insertedthrough the jack mounts 34 and also through openings 69′ defined by themounting flange 69 to secure lower portions of the jack modules 34 tothe chassis 32. To secure upper portions of the jack mounts 34 to thechassis 32, fasteners 127 are inserted through the jack modules 34 andthrough openings 78′ defined by the power strip cover plate 78. Afterthe jack modules 34 have been secured in the chassis 32, the front door46 is moved to the closed position of FIG. 2C. During the mountingprocess, the top panel 70′ can be removed to facilitate access to theinterior of the chassis 32.

To remove the jack mounts 34 from the chassis 32, the door 46 is openedas shown in FIG. 2A and the fasteners 127 are removed. After removal ofthe fasteners 127, the jack mounts 34 can be manually pulled from thefront of the chassis 32.

II. DSX Jack Module of First Embodiment

FIG. 5A shows one of the jack modules 34 in isolation from the remainderof the DSX system 30. The jack module 34 includes the jack mount 35 forholding the jacks 36, 38. The jack module 34 also includes onecross-connect block 40 and one IN/OUT block 42. The cross-connect block40 and the In/OUT block 42 are preferably formed on a single integralpiece of dielectric material (e.g., plastic) that is removably connectedto a lower edge of the jack mount 35 (e.g., by a tongue and groveconfiguration as disclosed in U.S. Pat. No. 6,116,961 that is herebyincorporated by reference). The jack module 34 further includes aprinted circuit board 124 for providing electrical connections betweenthe jacks 36, 38 and the wire wrap pins 44 of the cross-connect andIN/OUT blocks 40, 42. A dielectric back piece 126 covers a back side ofthe printed circuit board 124.

a. Jack Mount

The jack mount 35 of each jack module 34 is preferably configured toremovably receive the odd and even DSX jacks 36 and 38. For example, thejacks 36 and 38 can be retained within the jack mount 35 by resilientlatches 37 as described in U.S. Pat. No. 6,116,961. By flexing thelatches 37, the jacks 36 and 38 can be manually removed from the jackmount 35. When the jacks 36 and 38 are removed from the jack mount 35,the jacks 36 and 38 are electrically disconnected from the circuit board124. While the jack module 34 is shown as a “four-pack” (i.e., a moduleincluding four jacks), it will be appreciated that alternative modulescan include jack mounts sized to receive more or fewer than four jacks.

The jack mount 35 of each jack module 34 includes a plurality of sockets136 (shown in FIG. 5B) for providing electrical interfaces with thejacks 36, 38 when the jacks 36, 38 are mounted in the jack mounts 35.The sockets 136 include contact pins 138 electrically connected directlyto the printed circuit board 124.

b. DSX Jacks

Referring to FIG. 5A, each of the jacks 36, 38 includes a front facedefining an OUT Port 128, a MONITOR-OUT Port 129, an IN Port 130 and aMONITOR-IN Port 131. The ports 128–131 are sized to receive tip-and-ringplugs. The jacks 36, 38 also define LED ports 132 for receiving tracerlamps. The jacks 36, 38 include electrical contacts 133 corresponding toeach of the ports 128–132. The contacts 133 include tails 134 thatproject rearwardly from each of the jacks 36, 38. When the jacks 36, 38are inserted within the jack mount 35, the tails 134 of the contacts 133slide within sockets 136 of the jack mount 34 (best shown in FIG. 5B) toprovide electrical connections between the circuit board 124 and thejacks 36, 38. When the jacks 36, 38 are removed from the jack mount 120,the jacks 36, 38 are electrically disconnected from the circuit board124.

Referring to FIGS. 6A and 6B, the electrical contacts of the jacks 36,38 include voltage contacts −48V, tracer lamp contacts TL and returncontacts RET corresponding to the LED circuits. The electrical contactsalso include tip springs T and ring springs R corresponding to theMONITOR-IN and MONITOR-OUT ports. The electrical contacts furtherinclude tip-in contacts TI, ring-in contacts RI, cross-connect tip-incontacts XTI and cross-connect ring-in contacts XRI corresponding to theIN ports. The electrical contacts further include tip-out contacts TO,ring-out contacts RO, cross-connect tip-out contacts XTO andcross-connect ring-out contacts XRO corresponding to the OUT ports. Thecontacts operate in the same manner described in U.S. Pat. No. 6,116,961that was previously incorporated by reference. The contacts TI, RI, XTIand XRI and the contacts TO, RO, XTO and XRO cooperate to definenormally “through” or normally “closed” switches.

c. Circuit Board and Back Piece

As shown in FIG. 5B, the circuit board 124 is positioned directly behindthe jack mount 35, the cross-connect block 40 and the IN/OUT block 42.The circuit board 124 includes a first portion 124 a adjacent to andco-extensive with the back side of the jack mount 35. The first portion124 a includes a plurality of plated through-holes 139 that receive thecontact pins 138 of the sockets 136 to provide a direct electricalconnection between the circuit board 124 and the pins 138.

The circuit board 124 also includes a second portion 124 b adjacent toand co-extensive with the back side of the cross-connect block 40. Thesecond portion 124 b includes a plurality of plated through-holes 146that receive back ends of the wire wrap pins 44 mounted at thecross-connect block 40. This provides a direct electrical connectionbetween the circuit board 124 and the pins 44 of the cross-connectblock.

The circuit board 124 further includes a third portion 124 c adjacent toand co-extensive with the back side of the IN/OUT block 42. The thirdportion 124 c includes a plurality of plated through-holes 148 thatreceive the wire wrap pins 44 of the IN/OUT block 42 to provide a directelectrical connection between the circuit board 124 and the pins 44.

The back piece 126 of each jack module 34 is preferably made of adielectric material and is sized to cover the back side of the circuitboard 124. The back piece 126 defines a plug 82 b that electricallyconnects with a corresponding one of the receptacles 82 a of the chassis32 when the jack mounts 34 are mounted in the chassis 32. The plugs 82 binclude sleeve ground pins 88 b, power/voltage pins 90 b and powerreturn pins 92 b that are respectively received in the sleeve groundsockets 88 a, the power sockets 90 a, and the power return sockets 92 aof the receptacles 82 a when the plugs 82 b and the receptacles 82 a arecoupled. The pins 88 b, 90 b and 92 b are connected directly to thecircuit board 124 (e.g., the pins extend within plated through-holes 93defined by the circuit board 124).

Referring to FIGS. 6A and 6B, the circuit board 124 includes tracings290 that electrically connect the wire wrap pins 44 of the IN/OUT block42 to sockets corresponding to the contacts TI, RI, TO and RO of thejacks 36, 38. The circuit board 124 also includes tracings 292 thatprovide electrical connections between the wire wrap pins 44 of thecross-connect block 40 and sockets corresponding to contacts XTI, RTI,XTO and XRO of the jacks 36, 38. Additionally, the circuit board 124includes tracings 294 for electrically tracings 290 to the socketscorresponding to the contacts of the MONITOR ports of the jacks 36, 38.Further, the circuit board 124 includes tracings 296 for connecting thesleeve ground pins 88 b to sockets corresponding to the sleeve groundcontacts SG of the jacks 36, 38; tracings 298 for connecting tracer lamppins of the cross-connect panels 40 to sockets corresponding to thetracer lamp contacts TL of the jacks 36, 38; tracings 100 for connectingpower pins 90 b to sockets corresponding to the voltage contacts −48V ofthe jacks 36, 38; and tracings 102 for connecting power return pins 92 bto sockets corresponding to the return contacts RET of the jacks 36, 38.

d. Cross-Connect Block and IN/OUT Block

Referring to FIG. 5B, the cross-connect block 40 and the IN/OUT block 42of each jack module 34 can include a one-piece support structure 147preferably made of a dielectric material such as plastic. The supportstructure defines a first field or array of openings 143 for receivingthe wire wrap pins 44 of the cross-connect block 40. The supportstructure also defines a second field or array of openings 145 forreceiving the wire wrap pins 44 of the IN/OUT block 42. The pins 44 arepreferably press fit or staked through the openings 143, 145 andpreferably have rear ends that project rearwardly from the supportstructure. The rear ends of the pins 42 preferably terminate at thecircuit board 124 to provide an electrical connection therewith.

e. Assembly of Jack Mount

The jack module 34 is assembled by press fitting contact pins 138 intothe sockets 136 of the jack mount 35, staking the wire termination pins44 of the cross-connect block 40 through openings 143 of the supportstructure 147 and staking the wire termination pins 44 of the OUT/INblock 42 through the openings 145 of the support structure 147. Afterthe pins 138 and 44 have been press fit or staked within theirrespective components, the support structure 147 is connected to abottom edge of the jack mount 35 (e.g., by a snap-fit connection). Inother embodiments, the jack mount 35 and the support structure 147 canbe formed as a single integral piece. Once the support structure 147 andthe jack mount 35 have been connected, the resultant piece ismechanically and electrically connected to the circuit board 124 byinserting rear ends of pins 138, 44 within their corresponding platedthrough holes 139, 146 and 148 defined by the circuit board 124. Therear ends of the pins 138, 44 can be soldered in the board 124 tofurther secure the connections. Pins 88 b, 90 b and 92 b are alsoinserted within their corresponding plated-through holes 93 defined bythe circuit board 124. The back cover piece 126 is then placed over theback side of the circuit board 124 and fasteners 127 (shown in FIG. 5B)are used to secure the assembly together. As described above, thefasteners 127 also function to secure the jack modules 34 within thechassis 32.

III. Use of DSX System

It will be appreciated that the DSX system 30 operates in the samemanner as a conventional DSX system. The IN/OUT blocks 42 allow thejacks 36, 38 to be connected to pieces of digital equipment. Thecross-connect blocks 40 allow the jacks 36, 38 to be cross-connected bysemi-permanent jumpers. The jacks 36, 38 provide normally-throughconnections between the digital equipment connected to the IN/OUT blocks42 and the cross-connect blocks 40. By inserting patch plugs in theMONITOR ports of the jacks 36, 38, signals passing through the jacks 36,38 can be monitored without interrupting the signals. The tracer lampcircuits allow the cross-connected jacks being monitored to be traced asis described in U.S. Pat. No. 6,116,961. Plugs can be inserted in the INor OUT ports of the jacks 36, 38 for testing or diagnostic purposes, orfor re-routing signals to different pieces of digital equipment.

IV. Alternative Embodiment

FIGS. 7A–7C show a DSX system 30′ that is another embodiment of thepresent invention. Many of the components of the DSX system 30′ areidentical to components of the DSX system 30. These identical componentshave been assigned identical reference numbers.

The DSX system 30′ The DSX system 30 includes a chassis 32′ for holdinga plurality (e.g., 16) of removable jack modules 34′. Each of the jackmodules 34′ includes a jack mount 35 configured to hold a plurality ofjacks (e.g., two odd jacks 36 and two even jacks 38). The jack modules34′ also each include a forwardly facing cross-connect array 40 and aforwardly facing IN/OUT array 42 and a forwardly facing MONITOR array43. The arrays 40, 42 and 43 include a plurality of terminationstructures such as wire wrap pins 44 or other types ofconnectors/contacts for terminating a wire (e.g., insulationdisplacement connectors or other connectors). The chassis 32′ of the DSXsystem 30′ includes a front door 46′ for covering the cross-connectarray 40, the IN/OUT array 42 and the MONITOR array 43. The door 46′ isthe same as the door 46 of FIGS. 2A–2C except lower panel 48′ has beenenlarged as compared to panel 48 so as to be sized to cover both theIN/OUT array 42 and the MONITOR array 43. As is apparent from FIG. 8,except for the height, the remainder of the chassis 32′ is the same asthe chassis 32 of FIG. 3.

Referring to FIGS. 9A–9D, the jack module 34′ has the same configurationas the jack module 34 of FIGS. 5A–5D except for the addition of theMONITOR array 43. The arrays 40, 42 and 43 are all provided on aone-piece support structure 147′ that removably connects to the jackmount 35. The wire wrap pins 44 of the arrays 40, 42 and 43 are stakedthrough the support structure 147′ and have rear ends electrically andmechanically terminated at circuit board 124′. Circuit board 124 iselongated as compared to circuit board 124 so as to complement theincreased length of the support structure 147′ caused by the addition ofthe MONITOR array 43. As shown in FIGS. 10A and 10B, the circuit board124′ includes tracings 300 for connecting the wire wrap pins 44 of theMONITOR array 43 to the tracings 290. The MONITOR array 43 allows IN andOUT signals passing through the jack module 34′ to be permanentlymonitored. As previously described, the IN and OUT signals can also bemonitored by inserting plugs in the MONITOR-IN or MONITOR-OUT ports ofthe jacks 36, 38.

The above specification, examples and data provide a completedescription of the manufacture and use of the composition of theinvention. Since many embodiments of the invention can be made withoutdeparting from the spirit and scope of the invention, the inventionresides in the claims hereinafter appended.

1. A telecommunications device comprising: a chassis including first andsecond portions; and a door covering the first and second portions ofthe chassis, the door including a first panel adapted to cover the firstportion of the chassis when in a closed position and a second paneladapted to cover the second portion of the chassis when in a closedposition, the first panel being pivotally connected to the chassis by afirst hinge allowing the first panel to pivot about a first pivot axisand the second panel being pivotally connected to the first panel by asecond hinge allowing the second panel to pivot about a second pivotaxis, the first pivot axis and the second pivot axis being parallel toone another, wherein, when the first and second panels are both in aclosed position, major front surfaces of the first and second panelsextend generally in the same plane.
 2. The telecommunications device ofclaim 1, further comprising a first termination field located at thefirst portion of the chassis and a second termination field located atthe second portion of the chassis.
 3. The telecommunications device ofclaim 2, wherein the first termination field includes IN/OUT terminationstructures and the second termination field includes cross-connectterminations structures wherein the door is configured such that thecross-connect termination structures are accessible by opening thesecond panel of the door while the IN/OUT termination structures remaincovered by the first panel of the door.
 4. The telecommunications deviceof claim 2, further comprising a removable cable management tray mountedbetween the first and second termination fields, the cable managementtray aligned generally with the second hinge.
 5. The telecommunicationsdevice of claim 1, wherein the chassis has a length of about 19 inches.6. The telecommunications device of claim 1, wherein the chassis has alength of about 23 inches.
 7. The telecommunications device of claim 1,further comprising a circuit designation label provided on the door. 8.The telecommunications device of claim 1, wherein the door includesretractable latches that slide behind retaining members located on thechassis keeping at least one of the panels closed relative to thechassis.
 9. The telecommunications device of claim 2, wherein thechassis includes a cable management structure provided in front of thefirst and second termination fields, the cable management structurealigned generally with the first hinge.
 10. The telecommunicationsdevice of claim 1, wherein the chassis includes first and secondsidewalls extending between a front and a back of the chassis, thechassis including rack-mounting structures adjacent the first and secondsidewalls.
 11. The telecommunications device of claim 1, wherein thechassis includes top and bottom walls interconnected by first and secondsidewalls, the top and bottom walls and the sidewalls cooperating todefine a chamber, the chassis including rack-mounting structuresadjacent the first and second sidewalls, the first panel being pivotallyconnected to a front edge of the bottom wall of the chassis by the firsthinge and the second panel being pivotally connected to an upper edge ofthe first panel by the second hinge.
 12. The telecommunications deviceof claim 11, wherein the first and second sidewalls of the chassisextend between a front and a back of the chassis, the first sidewallincluding a power panel and the second sidewall including a sleeveground panel mounted thereon, the power panel and the sleeve groundpanel allowing all grounding and power source wiring of the chassis tobe accomplished from the front of the chassis.
 13. Thetelecommunications device of claim 3, wherein the second panel is tallerthan the first panel.
 14. The telecommunications device of claim 3,wherein the first panel is adapted to cover the IN/OUT terminationstructures and also MONITOR termination structures located in the firstportion of the chassis.
 15. A telecommunications device comprising: achassis including a front side and a back side; a plurality ofjacksmounted in the chassis, the jacks including ports adapted for receivingplugs, the jacks including switches for contacting the plugs when theplugs are inserted within the ports, the ports being located at thefront side of the chassis; cross-connect termination structures locatedat the front side of the chassis; IN/OUT termination structures locatedat the front side of the chassis; a circuit board including a firstportion located behind the jacks, a second portion located behind thecross-connect termination structures and a third portion located behindthe IN/OUT termination structures; and a door for covering thecross-connect termination structures and the IN/OUT terminationstructures located in front of the chassis, the door including a firstpanel pivotally connected to the chassis by a first hinge, the firstpanel adapted to cover the IN/OUT termination structures, the door alsoincluding a second panel pivotally connected to the first panel by asecond hinge, the second panel adapted to cover the cross-connecttermination structures.
 16. The telecommunications device of claim 15,further comprising a removable cable management tray mounted between thecross-connect termination structures and the IN/OUT terminationstructures, the cable management tray aligned generally with the secondhinge for keeping cross-connect cables separate from IN/OUT cables. 17.The telecommunications device of claim 15, wherein the cross-connecttermination structures are accessible by opening the second panel of thedoor while the IN/OUT termination structures remain covered by the firstpanel of the door.
 18. A telecommunications device comprising: a chassisincluding first and second portions, a first termination field beinglocated at the first portion of the chassis and a second terminationfield being located at the second portion of the chassis, the firsttermination field including IN/OUT termination structures and alsoMONITOR termination structures and the second termination fieldincluding cross-connect terminations structures; and a door covering thefirst and second portions of the chassis, the door including a firstpanel adapted to cover the first portion of the chassis and a secondpanel adapted to cover the second portion of the chassis, the firstpanel being pivotally connected to the chassis by a first hinge allowingthe first panel to pivot about a first pivot axis and the second panelbeing pivotally connected to the first panel by a second hinge allowingthe second panel to pivot about a second pivot axis, the first pivotaxis and the second pivot axis being parallel to one another, whereinthe door is configured such that the cross-connect terminationstructures are accessible by opening the second panel of the door whilethe IN/OUT termination structures and the MONITOR termination structuresremain covered by the first panel of the door.
 19. Thetelecommunications device of claim 18, wherein the first panel is tallerthan the second panel.
 20. A telecommunications device comprising: achassis including first and second portions; a first termination fieldlocated at the first portion of the chassis and a second terminationfield located at the second portion of the chassis, the firsttermination field including IN/OUT termination structures and the secondtermination field including cross-connect terminations structures; and adoor covering the first and second portions of the chassis, the doorincluding a first panel adapted to cover the first portion of thechassis when in a closed position and a second panel adapted to coverthe second portion of the chassis when in a closed position, the firstpanel being pivotally connected to the chassis by a first hinge and thesecond panel being pivotally connected to the first panel by a secondhinge, the first and second hinges being oriented parallel to oneanother, the door being configured such that the cross-connecttermination structures are accessible by opening the second panel of thedoor while the IN/OUT termination structures remain covered by the firstpanel of the door, wherein, when the first and second panels are both ina closed position, major front surfaces of the firstand second panelsextend generally in the same plane.
 21. The telecommunications device ofclaim 20, wherein the second panel is taller than the first panel. 22.The telecommunications device of claim 20, wherein the first panel isadapted to cover the IN/OUT termination structures and also MONITORtermination structures located in the first portion of the chassis. 23.A telecommunications device comprising: a chassis including first andsecond portions; and a door covering the first and second portions ofthe chassis, the door including a first panel adapted to cover the firstportion of the chassis and a second panel adapted to cover the secondportion of the chassis, the first panel being pivotally connected to thechassis by a first hinge allowing the first panel to pivot about a firstpivot axis and the second panel being pivotally connected to the firstpanel by a second hinge allowing the second panel to pivot about asecond pivot axis, the first pivot axis and the second pivot axis beingparallel to one another, wherein the chassis includes top and bottomwalls interconnected by first and second sidewalls, the top and bottomwalls and the sidewalls cooperating to define a chamber, the chassisincluding rack-mounting structures adjacent the first and secondsidewalls, the first panel being pivotally connected to a front edge ofthe bottom wall of the chassis by the first hinge and the second panelbeing pivotally connected to an upper edge of the first panel by thesecond hinge.
 24. The telecommunications device of claim 23, wherein thefirst and second sidewalls of the chassis extend between a front and aback of the chassis, the first sidewall including a power panel and thesecond sidewall including a sleeve ground panel mounted thereon, thepower panel and the sleeve ground panel allowing all grounding and powersource wiring of the chassis to be accomplished from the front of thechassis.
 25. A telecommunications device comprising: a chassis includingfirst and second portions; and a door covering the first and secondportions of the chassis, the door including a first panel adapted tocover the first portion of the chassis and a second panel adapted tocover the second portion of the chassis, the first panel being pivotallyconnected to the chassis by a first hinge allowing the first panel topivot about a first pivot axis and the second panel being pivotallyconnected to the first panel by a second hinge allowing the second panelto pivot about a second pivot axis, the first pivot axis and the secondpivot axis being parallel to one another, wherein the door includesretractable latches that slide behind retaining members located on thechassis keeping at least one of the panels closed relative to thechassis.